구분 |
발행년월 |
논문명 |
학술지명 |
SCIE |
2021.02.08 |
Microstructure Analysis of Solder Bump Fabricated by Sn Electroplating on a PCB Substrate |
Korean Journal of Metals and Materials |
SCI |
2020.03.03 |
Effect of Wire-Drawing Process Conditions on Secondary Recrystallization Behavior During Annealing in High-Purity Copper Wires |
Metals and Materials International |
SCI |
2020.01.01 |
Bottom-up Cu Filling of Annular through Silicon vias: Microstructure and Texture |
Electrochimica Acta |
SCI |
2018.10.22 |
Working Mechanism of Iodide Ions and its Application to Cu Microstructure Control in Through Silicon Via Filling |
Electrochimica Acta |
SCIE |
2018.10.08 |
Effect of Shear Deformation Durng Drawing on Inhomogeneous Microstructures and Textures in High Purity Copper Wires after Annealing |
Korean Journal of Metals and Materials |
SCI |
2018.05.16 |
Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction |
Journal of the Electrochemical Society |
SCI |
2017.08.01 |
Effects of NiP Nodule Interfacial Morphology on Solder-Ball-Joint Reliability |
Nanoscience and Nanotechnology Letters |
SCI |
2017.05.24 |
Improvement of Efficiency in Graphene/Gallium Nitride Nanowire on Silicon Photoelectrode for Over Water Splitting |
Applied Surface Science |
SCI |
2016.12.08 |
The Effect of the Number of InGaN/GaN Pairs on the Photoelectrochemical Properties of InGaN/GaN Multi Quantum Wells |
Applied Surface Science |
SCI |
2016.10.01 |
Influence of Mg Flux on The Photoelectrochemical Properties of P-Type GaN for Hydrogen Production |
Journal of Nanoscience and Nanotechnology |
SCIE |
2016.04.04 |
Control of Impurity Concentrations in Copper Electrodeposits by using an Organic Additive |
Korean Journal of Metals and Materials |
SCI |
2015.12.31 |
Effect of Polarity on Phothelectrochemical Properties of Polar and Semipolar GaN Photoanode |
Journal of the Electrochemical Society |
SCI |
2015.11.24 |
Nucleation and Growth Behaviors of Pd Catalyst and Electroless Ni Deposition on Cu(111) Surface |
Journal of the Electrochemical Society |
SCI |
2015.07.10 |
Corrosion Behavior of Electroless Nickel/Immersion Gold Plating by Interfacial Morphology |
Electronic Materials Letters |
SCIE |
2014.11.14 |
Shape Change of Cu Pillar Solder Bump During Reflow Process and its Modeling |
Korean Journal of Metals and Materials |
SCI |
2014.11.11 |
Effect of Double-Layered n-Type GaN on the Photoelectrochemical Properties in NaOH Aqueous Solution |
Journal of the Electrochemical Society |
SCI |
2014.08.14 |
Effects of Precursor Concentration on the Properties of ZnO Nanowires Grown on (1-102) R-Plane Sapphire Substrates by Hydrothermal Synthesis |
Journal of Nanoscience and Nanotechnology |
SCI |
2013.09.10 |
The Effect of Rapid Temperature Annealing with N2 and H2 on Photoelectrochemical Properties of u-TiO2 |
Journal of the Electrochemical Society |
SCI |
2013.08.19 |
Inward Diffusion of Al and Ti3Al Compound Formation in the Ti-6Al-4V Alloy during High Temperature Gas Nitriding |
Surface and Coatings Technology |
SCIE |
2013.07.23 |
Effect of Microstructural Evolution on Electrical Properties of the Copper Electrodeposits for ULSI |
Korean Journal of Metals and Materials |
SCI |
2013.03.05 |
Optical Characterization of Periodically Polarity-Inverted ZnO Structures on (0001) Al2O3 Substrates |
Current Applied Physics |
SCI |
2013.01.10 |
The Polarity Effect on the Photoeletrochemical Properties of Ga- and N-Face Free-Standing GaN Substrate |
Japanese Journal of Applied Physics |
SCI |
2012.07.19 |
Selective Growth of GaN Rods on the Apex of GaN Pyramids by Metal Organic Vapor Phase Epitaxy |
Japanese Journal of Applied Physics |
SCI |
2012.02.23 |
Surface Polarity Effects on the Htdride Vapor Phase Epitaxial Growth of GaN on 6H-SiC with a Chrome Nitride Buffer Layer |
Electrochemical and Solid-State Letters |
SCI |
2012.02.07 |
Heteroepitaxial Growth of GaN on Various Powder Compounds (AIN, LaN, TiN, NbN, ZrN, ZrB2, VN, BeO)by Hydride Vapor Phase Epitaxy |
Electronic Materials Letters |
SCI |
2011.12.31 |
Effect of Micro-Elasticity on Grain Growth and Texture Evolution: A Phase Field Grain Growth Simulation |
Computational Materials Science |
SCI |
2011.12.20 |
Improvement of Light Extraction Efficiency and Reduction of Leakage Current in GaN-Based LED via V-Pit Formation |
IEEE Photonics Technology Letters |
SCIE |
2011.06.22 |
Effects of Driving Force and Surfactant on The Formation of Ag Powders |
Korean Journal of Metals and Materials |
SCI |
2011.03.28 |
Microstructure and Pattern Size Dependence of Copper Corrosion in Submicron-Scale Features |
Journal of the Electrochemical Society |
SCI |
2010.08.02 |
Effects of Low Temperature ZnO and MgO Buffer Thicknesses on Properties of ZnO Films Grown on (0001) Al2O3 Substrates by Plasma-Assisted Molecular Beam Epitaxy |
Thin Solid Films |
SCI |
2010.06.10 |
A Discrete Dislocation Dynamics Modeling for Thermal Fatigue of Preferred Oriented Copper Via Patterns |
Scripta Materialia |
SCI |
2010.04.15 |
An Empirical Equation Including The Strain Effect for Optical Transition Energy of Strained and Fully Relaxed GaN Films |
Journal of Physics D: Applied Physics |
SCI |
2009.09.02 |
Structural and Stimulated Emission Characteristics of Diameter-Controlled ZnO Nanowires using Buffer Structure |
Journal of Physics D: Applied Physics |
SCI |
2009.05.28 |
Leakage Current Improvement of Nitride-Based Light Emitting Diodes using CrN Buffer Layer and its Vertical Type Application by Chemical Lift-Off Process |
Applied Physics Letters |
SCI |
2009.05.18 |
Lateral Arrays of Vertical ZnO Nanowalls on A Periodically Polarity-Inverted ZnO Template |
Nanotechnology |
SCI |
2009.01.16 |
Lattice Strain in Bulk GaN Epilayers Grown on CrN/Sapphire Template |
Applied Physics Letters |
SCI |
2008.03.17 |
Characterization of the Crystallographic Microstructure of the Stress-Induced Void in Cu Interconnects |
Applied Physics Letters |
SCI |
2008.11.08 |
Growth of High-Quality ZnO Films on Al2O3(0001) by Plasma-Assisted Molecular Beam Epitaxy |
Journal of Crystal Growth |
SCI |
2008.06.04 |
Ordered Arrays of ZnO Nanorods Grown on Periodically Polarity-Inverted Surfaces |
Nano Letters |
SCI |
2008.05.21 |
Hydride Vapor Phase Epitaxy of GaN on the Vicinal C-Sapphire with a CrN Interlayer |
Journal of Crystal Growth |
SCI |
2008.02.10 |
Reduction of Dislocations in GaN Films on AIN/Sapphire Templates using CrN Nanoislands |
Applied Physics Letters |
SCI |
2008.02.01 |
The Fabrication of Vertical Light-Emitting Diodes Using Chemical Lift-Off Process |
IEEE Photonics Technology Letters |
SCI |
2007.11.23 |
The Roles of Low-Temperature Buffer Layer for Thick GaN Growth on Sapphire |
Journal of Crystal Growth |
SCI |
2007.10.31 |
Structural Investigation of Nitrided C-Sapphire Substrate by Grazing Incidence X-ray Diffraction and Transmission Electron Microscopy |
Applied Physics Letters |
SCI |
2007.10.18 |
Self-Separated Freestanding GaN using a NH4Cl Interlayer |
Applied Physics Letters |
SCI |
2007.01.09 |
Strain-Free GaN Thick Films Grown on Single Crystalline ZnO Buffer Layer with in Situ Lift-Off Technique |
Applied Physics Letters |
SCI |
2006.09.01 |
In Situ Observation of The Grain Growth of The Copper Electrodeposits for Ultralarge Scale Integration |
Applied Physics Letters |
SCI |
2005.07.29 |
Annealing Textures of Copper Damascene Interconnects for Ultra-Large-Scale Integration |
Journal of Electronic Materials |
SCI |
2005.01.05 |
Textural and Microstructural Transformation of Cu Damascene Interconnects after Annealing |
Journal of Electronic Materials |
SCI |
2005.01.01 |
The Effect of Stress Distribution on Texture Evolution of Cu Damscene Interconnects During Annealing |
Archives of Metallurgy and Materials |
SCI |
2004.08.27 |
Electron Bankscattered Diffraction Analysis of Copper Damascene Interconnect for Ultralarge-Scale Integration |
Thin Solid Films |
SCI |
2003.05.27 |
Effect of Stresses on the Evolution of Annealing Textures in Cu and AI Interconnects |
Journal of Electronic Materials |
SCIE |
1999.02 |
Manufacturing Processes and Acoustic of Jing and Kkwaenggwari |
Korean Journal of Metals and Materials |
SCIE |
1998.06.22 |
Electrodeposition of Copper for ULSI Metallization |
Korean Journal of Metals and Materials |
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